Display device

ABSTRACT

A display device includes a first substrate arranged with a plurality of pixels on a first surface, the plurality of pixels having a display element including a transistor, and a first wiring connected to the transistor, a through electrode arranged in a first contact hole reaching the first wiring from a second surface facing the first surface of the first substrate, a second wiring connected with the through electrode, a first insulation film arranged covering the second wiring on the second surface of the first substrate, and a terminal connected with a second wiring via a second contact hole arranged in the first insulation film.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.14/574,706, filed on Dec. 18, 2014, which, in turn, is based upon andclaims the benefit of priority from the prior Japanese PatentApplication No. 2013-269928, filed on Dec. 26, 2013, the entire contentsof which are incorporated herein by reference.

FIELD

The present invention is related to a structure of an input terminal ofa display device.

BACKGROUND

In recent years, the progress of display devices which controls thedisplay gradation of each pixel using a thin film transistor (TFT) suchas liquid display devices or organic EL (organic electroluminescence)display devices is developing. This type of display device is arrangedwith a terminal part connected to external circuits etc. from the needto supply a current to each of a plurality of pixels arranged with athin film transistor. This terminal part includes a structure in which aplurality of terminals which receive a current are arranged. It isimportant that these display devices prevent degradation of the terminalpart and improve the reliability of connections within the terminalpart.

In this respect, in a conventional display device, an aperture partwhich exposes the surface of a terminal electrode connected with a thinfilm transistor is formed on the surface of a TFT substrate formed witha plurality of thin film transistors, and the terminal electrodeconducts with the terminal of a wiring substrate arranged on the surfaceof the TFT substrate via the aperture part (for example, refer to patentdocument 1 [Japanese Laid Open Patent 2010-008677]).

However, in the case where of a arranging the structure of the displaydevice described in the patent document 1 described above, moistureenters into the interior of the display device from an aperture partformed in a glass substrate, corrosion occurs in those sectionsconnecting the terminal electrode and wiring substrate and there isdanger of badly affecting the reliability of the display device.

SUMMARY

An organic EL display device related to one embodiment of the presentinvention includes a first substrate arranged with a plurality of pixelson a first surface, the plurality of pixels having a display elementincluding a transistor, and a first wiring connected to the transistor,a through electrode arranged in a first contact hole reaching the firstwiring from a second surface facing the first surface of the firstsubstrate, a second wiring connected with the through electrode, a firstinsulation film arranged covering the second wiring on the secondsurface of the first substrate, and a terminal connected with a secondwiring via a second contact hole arranged in the first insulation film.

The first substrate may also include a resin. In addition, the resin mayalso include polyimide.

The first contact hole and the second contact hole may also be mutuallyarranged apart in plain view.

A second insulation film may be arranged on the second surface of thefirst substrate, and the first contact hole may reach the first wiringpassing through the second insulation film.

The first insulation film and second insulation film may include siliconnitride or silicon oxide, or may be stacked with films of siliconnitride and silicon oxide.

The second contact hole may be arranged further to the periphery edgeside of the first substrate than the first contact hole.

A second substrate may be arranged facing the first substrate with thefirst surface of the first substrate sandwiched therebetween.

The terminal may be connected with a flexible printed circuit substrate.In addition, a driver IC may be connected to the terminal. Furthermore,the terminal may be formed from a conductive film including a metaloxide.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a vertical cross-sectional diagram showing an approximatestructure of a display device related to one embodiment of the presentinvention;

FIG. 2 is a cross-sectional diagram for explaining a manufacturingprocess of the display device related to the first embodiment of thepresent invention;

FIG. 3 is a cross-sectional diagram for explaining a manufacturingprocess of the display device related to the first embodiment of thepresent invention;

FIG. 4 is a cross-sectional diagram for explaining a manufacturingprocess of the display device related to the first embodiment of thepresent invention;

FIG. 5A is a cross-sectional diagram for explaining a manufacturingprocess of the display device related to the first embodiment of thepresent invention;

FIG. 5B is a planar view diagram showing the structure of a terminal ofthe display device related to the first embodiment of the presentinvention;

FIG. 6 is a cross-sectional diagram for explaining a manufacturingprocess of the display device related to the first embodiment of thepresent invention;

FIG. 7 is a cross-sectional diagram for explaining a manufacturingprocess of the display device related to the first embodiment of thepresent invention;

FIG. 8 is a cross-sectional diagram for explaining an approximatestructure of a display device related to a second embodiment of thepresent invention;

FIG. 9 is a cross-sectional diagram for explaining an approximatestructure of a display device related to a third embodiment of thepresent invention;

FIG. 10 is a perspective view diagrams showing an approximate structureof another display device;

FIG. 11 is a cross-sectional diagram for explaining a manufacturingprocess of another display device;

FIG. 12 is a cross-sectional diagram for explaining a manufacturingprocess of another display device; and

FIG. 13 is a cross-sectional diagram an approximate structure of anotherdisplay device.

DESCRIPTION OF EMBODIMENTS

The aim of the present invention is to solve the problems describedabove by preventing water from entering the interior of a display devicefrom parts mounted on external circuits and provide a display devicewhich can secure a high level of reliability. In addition, it is a goalof the present invention to provide a display device which can bemounted with an external circuit without adversely affecting mountingyield.

The embodiments of the display device of the present invention areexplained below while referring to the drawings. Furthermore, thedisplay device of the present invention can be realized by variousmodifications without being limited to the embodiment described below.

FIG. 1 shows an approximate structure of a display device 100 related toa first embodiment of the present invention. Furthermore, although anorganic EL device arranged with an organic EL layer is given below as anexample of the display device 100 related to one embodiment of thepresent invention, the display device 100 related to the presentembodiment can also be applied to flat panel display devices such asself-emitting display devices, liquid crystal display device, orelectronic paper type display device which have electrophoreticelements.

The display device 100 related to one embodiment of the presentinvention is formed by arranging a display element layer 1 which formseach pixel above a substrate 2 comprised from a resin such as polyimideas is shown in FIG. 1. Although a detailed depiction is omitted in FIG.1, the display element layer 1 is formed by stacking in order from theside of the substrate 2, a TFT drive circuit layer, a reflectionelectrode, an organic EL layer, and a transparent electrode for example.The organic EL layer is formed for example by stacked an hole injectionlayer, a hole transport layer, a light emitting layer, an electrontransport layer, and an electron injection layer.

Because the organic EL layer quickly degrades when exposed to the watercomponent in the atmosphere, it is necessary to seal it from theexterior. As a result, the surface of the display element layer 1arranged with an organic EL layer is covered for example by atransparent sealing film 3 comprised from a silicon nitride film formedby CVD and is also covered by a substrate 6 comprised from a resin suchas polyimide etc. Below, a structure in which the display element layer1 and sealing film 3 are formed above the substrate 2 is called [firstsubstrate 7] and an opposing substrate 6 arranged facing the firstsubstrate 7 is called [second substrate 6]. The second substrate 6 mayinclude a color filter and may be arranged with a thin film devicearranged with a touch panel function etch according to thespecifications of the display device 100. In addition, by using asubstrate comprised from a resin such as polyimide for each of the firstsubstrate 7 and second substrate 6 respectively, the display device 100may be provided with flexibility.

Furthermore, for the substrate 2 and substrate 6, a resin other thanpolyimide can be used if the resin can withstand a heating temperatureused in the process for forming a TFT. In addition, in the case oftransferring a TFT onto the substrate 2 and substrate 6, a plasticsubstrate or film substrate may be used for the substrate 2 andsubstrate 6.

As is shown in FIG. 1, in the display device 100, the surface of thedisplay element layer 1 and surface of the second substrate 6 areparallel by maintaining a fixed distance of a gap between the firstsubstrate 7 and second substrate 6. In addition, in order to preventreflection or diffraction at the interface of the display element layer1 or second substrate 6, for example a transparent resin 4, 5 such as anepoxy resin is filled. In addition, the gap between the first substrate7 and second substrate 6 may be filled using a material other than theresin 4, 5 such as a known sealing material.

In this way, the flexible display device 100 is formed by bonding thefirst substrate 7 and second substrate 6 having flexibility. Below, thestructure of the display device 100 related to the first to thirdembodiments of the present invention is explained in detail whilereferring to FIG. 2 to FIG. 9.

First Embodiment

Below, the structure and manufacturing process of the display device 100related to the first embodiment of the present invention is explainedwhile referring to FIG. 2 to FIG. 7. FIG. 2 to FIG. 7 are diagrams forexplaining the manufacturing process of the display device 100 relatedto the first embodiment of the present invention.

As is shown in FIG. 2, the display element layer 1 including a TFT drivecircuit layer is formed above the substrate 2 comprised from a resinsuch as polyimide and is covered by a sealing film 3 thereby forming thefirst substrate 7. In addition, the second substrate 6 is formed by alayer 8 including a color filter to a substrate 9 comprised from a resinsuch as polyimide. Here, the substrates 2 and 9 comprised from a resinare formed to a thickness of about 10 um. Furthermore, although astructure in which only the second substrate 6 is formed above amanufacture purposed glass substrate 10 is shown in FIG. 2, the firstsubstrate 7 is also formed above a manufacture purposed glass substrate10. The glass substrate 10 is used as a support substrate for the firstsubstrate 7 and second substrate 6 in the manufacturing process and thedisplay device 100 is formed by finally peeling the glass substrate 10.

The first substrate 7 and second substrate 6 supported by this type ofglass substrate 10 is bonded via resins 4 and 5. For example, the resin4 with comparatively high viscosity before curing is formed in a frameshape using a dispenser etc. above the surface of the first substrate 7,and the resin 5 with comparatively low viscosity before curing is filledinto the space enclosed by the resin 4. In this way, it is possible tocontinue present the resin 5 with a comparatively low viscosity fromflowing outside the resin 4 and make the resin 5 spread evenly acrossthe surface of the first substrate 7. From the difference of thefunctions of each of these resins 4 and 5, the resin 4 with acomparatively high viscosity before curing is referred to below as[Dam], and the resin 5 with a comparatively low viscosity is referred toas [Fill].

The first substrate 7 and second substrate 6 are bonded within a chamberunder reduced pressure, the fill material 5 is pushed across the entirearea of a space enclosed by the first substrate 7, second substrate 6and dam material 4 and the dam material 4 and fill material 5 are curedand bonded under an atmosphere. In this way, as is shown in FIG. 2, thefill material 5 is formed covered by the entire display region.

Next, the glass substrate for manufacturing purposes bonded with thefirst substrate 7 is peeled using an existing method such as irradiatinglaser light for example. A UV laser may be used as the laser light.Furthermore, in the structure shown in FIG. 2 to FIG. 9, although thefirst substrate 7 is shown with a cross-sectional structure whichbecomes a lower side, each manufacturing process is performed with theglass substrate 10 formed with the second substrate 6 is arranged on thelower side.

As is shown in FIG. 3, a contact hole is formed from the substrate 2side using an existing method such as photolithography. The contact holeis formed so as to reach at least one part of a wiring which isconnected to a plurality of thin film transistors included in the TFTdrive circuit layer. Next, a conductive paste or plating etc. is filledinto the contact hole and a through electrode 11 is formed connected tothe wiring connected with the thin film transistor.

Next, as is shown in FIG. 4, wiring 12 which is connected with thethrough electrode 11 above the substrate 2 is formed using a patterningmethod such as photolithography. The wiring 12 may be formed using ametal material such as aluminum, copper or silver etc. Furthermore, aplurality of wires 12 is actually formed above the substrate 2.

Next as is shown in FIG. 5A, an insulation film 13 is formed above thesubstrate 2 formed with the wiring 12. The insulation film 13 is formedusing a stacked inorganic film such as silicon nitride and siliconoxide. Although one insulation film 13 is shown in FIG. 5A, as long asit is possible to realize the flexible display device 100, theinsulation film may be comprised from two films of three films and isnot limited to the structure shown in the diagram. In this way, byforming the insulation film 13 which covers the plurality of wires 12over the entire surface of the substrate 2, it is possible to controlwater from entering into the substrate 2 comprised from a resin andinsulate the plurality of wires 12 from a terminal 14 described below.

Next, as is shown in FIG. 5A, after forming the contact hole whichreaches at least one part of the plurality of wires 12 using an existingmethod such as photolithography, a plurality of terminals 14 is formedconnected to the plurality of wires 12 via the contact hole. At thistime, the contact hole formed in the insulation film 13 is formed in aposition separated from the position of the contact hole formed with thethrough electrode 11. Specifically, the contact hole formed with thethrough electrode 11 and the contact hole formed in the insulation film13 are arranged apart in a position so they do not overlap each other inthe stacked direction of the first substrate 7 and insulation film 13(that is, in the direction of the insulation film 13 in a planar view).In this way, because the positions of the contact holes which can becomea path for water to enter are no longer linked, it is possible to obtaina structure in which it is difficult for water to enter the interior ofthe display device 100.

In addition, the contact hole formed in the insulation film 13 may bearranged further on the periphery part of the first substrate 7 than thecontact hole formed with the through electrode 11. In this way, anexternal circuit 15 (described below) connected to the terminal 14 canbe arranged in the periphery part of the first substrate 7. Therefore,for example, when mounting the external circuit 15 using a method suchas thermocompression, it is possible to reduce the effects caused byheat on the display region arranged with a plurality of pixels of thefirst substrate 7. In addition, by arranged the contact hole formed inthe insulation film in the periphery part of the first substrate 7,because it is possible to arranged a contact hole which can become apath for water to enter in a position apart from the display region, itis possible to control water from entering each pixel of the displayregion.

The terminal 14 is formed in the contact hole formed with the insulationfilm 13 using an existing method such as photolithography using aconductive film including a known metal oxide such as ITO, IZO or ZnO.In this way, by forming the terminal 14 using a conductive filmincluding moisture resistance such as ITO, IZO or ZnO, it is possible toprevent corrosion of the terminal 14 which is connected with a terminalof the external circuit 15.

Here, as is shown in FIG. 5B, adjacent pairs of the plurality ofterminals 14 may be arranged mutually different. By arranging aplurality of terminals 14 in this way, it is possible to insulate aplurality of terminals 14 from each other with a sufficient distance.

After forming the terminal 14, individual display devices 100 areseparately cut by performing a separation process. The structure inwhich the first substrate 7 and second substrate 6 are bonded may beseparated by cutting the region of each display device 100 usingirradiation of laser light.

As is shown in FIG. 6, after the separation process, the terminal 14 andterminal of the external circuit 15 are respectively connected and theexternal circuit 15 is mounted. The external circuit 15 may be a FPC(flexible printed circuit) or driver IC etc. which supply a drive signaletc. to the thin film transistor. After the mounting process of theexternal circuit 15, by peeling the glass substrate 10 shown in FIG. 6using an existing method such as irradiating laser light, it is possibleto obtain the structure of the display device 100 shown in FIG. 7.

In this way, because the display device 100 shown in FIG. 7 is arrangedwith a structure in which light is irradiated from the second substrate6 side including the layer 8 which includes a color filter, the externalcircuit 15 is arranged on the rear surface of the first substrate 7 onthe opposite side of the display screen side. By arranging this type ofstructure, it is possible to make the surface of the second substrate 6which forms a display screen flat.

Here, as is shown in FIG. 10 to FIG. 13, a display device 200 isimagined with a structure in which a terminal part 38 arranged with aplurality of terminals 32 connected to an external circuit 34 is exposedby removing a part of a second substrate 26. In this case, because it isnecessary to remove the second substrate 26 above the terminal part 38,a step is formed in the part where the second substrate 26 is removed.

However, according to the present embodiment, because it is possible toform a flat surface of the second substrate 6 which forms a displayscreen without a step, it is possible to widen a display region as muchas possible according to the size of the second substrate 6. Therefore,according to the present embodiment it is possible to increase the levelof freedom when incorporating the display device 100 into an electronicproduct, and it is possible to realize a narrow frame of the displaydevice 100.

FIG. 10 to FIG. 13 are referred to again. In FIG. 10 to FIG. 13, unlikethe display device 100 related to the present embodiment, a structureand manufacturing process of the display device 200 arranged with theterminal part 38 exposed from the second substrate 26 is are shown. Thedisplay device 200 is arranged with resin layers 22, 29 comprised from aresin such as polyimide on the first substrate 27 and second substrate26 respectively. As is shown in FIG. 12, in the manufacturing process ofthe display device 200, in order to expose the plurality of terminals 32connected with the external circuit 34 in the terminal part 38, it wasnecessary to cut the second substrate above the terminal part 38 at theposition shown by the dotted line 26 a. At this time, for example, whencutting by irradiating laser light, because the first substrate 27 isalso cut, cutting using a method such as scribe break is generally used.However, according to the scribe break method, a resin layer 29 includedin the second substrate 26 often remains in a round shape above theterminal part 38 without being completely cut. In this way, when thesecond substrate 26 remains without being cut, there is a danger thatthis will become an obstruction when mounting the external circuit 34.

However, according to the present embodiment, because it is notnecessary to remove the second substrate 26 above the terminal part 38in the places where the external circuit 15 is mounted as in the displaydevice 200 shown in FIG. 10 to FIG. 13, there is no danger of the resinlayer 29 remaining above the terminal part 38. Therefore, according tothe present embodiment, it is possible to mount the external circuit 15without badly affecting mounting yield. That is, it is possible toprevent the occurrence of mounting defects when mounting the externalcircuit 15 and secure reliability of the display device 100.

In addition, according to the present embodiment, insulation is securedby covering the wiring 12 using the insulation film 13 which includes aninorganic film such as silicon nitride, and it is possible to obtain astructure in which a terminal 14 is formed using a conductive film whichis strong to corrosion such as ITO within the contact hole formed in theinsulation film 13. In this structure, by closing the contact hole ofthe insulation film 13 using the terminal 14, it is possible to controlmoisture from entering the interior of the display device 100 andprevent the occurrence of corrosion in places which are connected withthe external circuit 15.

In order to realize the flexible display device 100, in the case offorming a contact hold in the second substrate using a resin with highmoisture permeability such as polyimide in the first substrate 7 andsecond substrate 6, there is a danger that moisture may easily enter theinterior of the display device 100 from the contact hole. However, as inthe present embodiment, by forming the insulation film 13 to cover thewiring 12 on the entire surface of the substrate 2, it is possible tocontrol water from entering the substrate 2. Furthermore, it is possibleto prevent water from entering the interior of the display device 100 byarranging the position of the contact hole formed in the substrate 2 andthe position of the contact hold formed in the insulation film 13mutually apart, and it is possible to prevent the occurrence ofcorrosion in the places which are connected with the external circuit15. Therefore, according to the present embodiment, it is possible toprovide a display device 100 which can secure a high level ofreliability without water entering the interior of the display device100 from parts where the external circuit 15 is mounted.

Second Embodiment

Next, a display device 300 related to the second embodiment of thepresent invention is explained while referring to FIG. 8. FIG. 8 is across-sectional diagram for explaining an approximate structure of thedisplay device 300 related to the second embodiment of the presentinvention.

Furthermore, the display device 300 related to the second embodiment ofthe present invention is different to the display device 100 related tothe first embodiment of the present invention in that the wiring 12formed above the substrate 2 is not formed from one layer but formedfrom two layers 12 a, 12 c by increasing the number of formationprocesses of the insulation film 13 and the number of photolithographyprocesses. Therefore, the same reference symbols are attached to thesame structure as the structure described above shown in FIG. 2 to FIG.7 and a detailed explanation is omitted below.

As is shown in FIG. 8, although the display device 300 related to thesecond embodiment of the present invention is arranged with a structurein which two wiring layers 12 a, 12 c are arranged above the substrate2, the present embodiment is not limited to two layers, a plurality oflayers of three of more may also be arranged. Although not shown indetail in FIG. 8, a plurality of layers is formed since the insulationfilm 13 is mutually insulated by different wiring layers 12 a, 12 c. Theplurality of wiring layers 12 a, 12 c are connected via a throughelectrode 12 b formed in the insulation film 13.

In this way, according to the present embodiment, a structure isarranged in which the insulation film 13 and wiring 12 a, 12 c which areformed by a plurality of layers are formed on the rear side of the firstsubstrate 7. As a result, it is possible to arrange the insulation film13 which is formed from a plurality of layers between the throughelectrode 11 which is connected to a TFT drive circuit layer and theterminal 14 which is connected to the external circuit 15. Therefore,according to the display device 300 related to the second embodiment ofthe present invention, it is possible to prevent water from entering theinterior of the display device 300 from parts on which the externalcircuit is mounted by using the insulation film 13 formed using aplurality of layers and exhibit the effect of preventing corrosion.

Third Embodiment

Next, a display device 400 related to the third embodiment of thepresent invention is explained while referring to FIG. 9. FIG. 9 is across-sectional diagram for explaining an approximate structure of thedisplay device 400 related to the third embodiment of the presentinvention.

Furthermore, the display device 400 related to the third embodiment ofthe present invention is different to the display device 100 related tothe first embodiment of the present invention in that after forming afirst insulation film 13-1 which covers the entire surface of the firstsubstrate 7 (substrate 2), the through electrode 11 connected to the TFTdrive circuit layer is formed. Therefore, the same reference symbols areattached to the same structure as the structure described above shown inFIG. 2 to FIG. 7 and a detailed explanation is omitted below.

As is shown in FIG. 9, in the display device 400 related to the thirdembodiment of the present invention, a first insulation film 13-1 whichcovers the entire surface of the substrate 2 in the rear surface of thesubstrate 2 which becomes the opposite side to the display screen side.Following this, the through electrode 11 is formed which passes throughthe substrate 2 and first insulation film 13-1 and is connected to theTFT drive circuit layer.

Furthermore, after the wiring 12 which is connected with the throughelectrode 11 is formed, a second insulation film 13-2 which covers thefirst insulation film 13-1 and wiring 12 is formed. Here, the secondinsulation film 13-2 corresponds to the insulation film 13 of thedisplay device 100 related to the first embodiment of the presentinvention. In addition, the first insulation film 13-1 and secondinsulation film 13-2 may be formed using the same material as theinsulation film 13.

In this way, after covering the entire rear surface of the secondsubstrate 2 comprised from a resin with high moisture permeability usingthe first insulation film 13-1 which includes an inorganic film such assilicon nitride, the entire rear surface of the first insulation film13-1 formed with the wiring 12 is covered using the second insulationfilm 13-2. In this way, it is possible to control water from enteringthe substrate 2 and control water from entering the interior of thedisplay device 100 from the contact hole formed in the substrate 2 andthe first insulation film 13-1. Therefore, according to the displaydevice 400 related to the third embodiment of the present invention, itis possible to prevent water from entering the interior of the displaydevice 400 and prevent the occurrence of corrosion in the placesconnected with the external circuit 15.

As described above, according to the display devices related to thefirst to third embodiments of the present invention, it is possible toprevent water from entering the interior of a display device from partson which an external circuit is mounted and provide a display devicewhich can secure a high level of reliability. In addition, it ispossible to provide a display device which can be mounted with anexternal circuit without adversely affecting mounting yield.

What is claimed is:
 1. A display device comprising: a first substratearranged with a plurality of wiring structures and a plurality of pixelson a first surface of a first layer, each of the plurality of pixelshaving a display element including a transistor, one of the plurality ofwiring structures comprises: a first wiring connected to the transistor;a through electrode in a first contact hole passing through from thefirst surface to a second surface which is an opposite side surface ofthe first surface of the first layer; a second wiring connected with thethrough electrode, the second wiring being between the first layer and afirst insulation film; and a terminal directly connected with the secondwiring via a second contact hole arranged in the first insulation film,wherein the second wiring has an upper surface and a bottom surface, theupper surface and bottom surface are flat surfaces, a line width of thesecond wiring is narrower than a width of the terminal in a plan view,the first contact hole and the second contact hole do not overlap in aplan view, and each of the second contact holes of one of the pluralityof wiring structures is arranged in a zigzag manner in a plan view. 2.The display device according to claim 1, wherein the first layerincludes a resin.
 3. The display device according to claim 1, whereinthe first insulation film includes an inorganic material.
 4. The displaydevice according to claim 1, wherein the first insulation film includessilicon nitride or silicon oxide.
 5. The display device according toclaim 1, wherein the terminal is a conducive film including a metaloxide.
 6. The display device according to claim 1, wherein the pluralityof wiring structures includes a first terminal, a second terminal, and athird terminal, the closest terminal to the first terminal is the secondterminal in a plan view, and the second closest terminal to the firstterminal is the third terminal in a plan view; a first straight lineconnecting a center of the first terminal and a center of the secondterminal, and a second straight line connecting the center of the firstterminal and a center of the third terminal, are not parallel in a planview.
 7. The display device according to claim 1, wherein the display isan organic EL display.
 8. The display device according to claim 1,wherein a plurality of terminals directly connected with each of thesecond wiring via the second contact hole arranged in the firstinsulation film are lined in a first direction and in a second directionand two adjacent second contact holes of two of the plurality of wiringstructure are aligned in the first direction and another two adjacentsecond contact holes of another two of the plurality of wiring structureare aligned in the second direction.
 9. The display device according toclaim 8, wherein the first direction and the second direction cross eachother diagonally.
 10. The display device according to claim 8, wherein anumber of each terminal in the plurality of terminals lined in the firstdirection is the same.